Developing Reliable Power Electronics
Power electronics are used in products as diverse as cell phone towers, electric aircraft, wind turbines, autonomous vehicles, smart grids, and data centers. This widespread incorporation has resulted in significant improvements in efficiency, but it also has made it essential that the reliability of power electronics be characterized and enhanced. Recently, increased power levels combined with increased packaging density have led to higher heat densities in power electronic systems, making thermal management more critical to performance and reliability of power electronics. Furthermore, today’s most challenging applications of electronics require operation in harsh environments. This presentation will discuss the latest work in the areas of wide bandgap semiconductor reliability, high temperature interconnection, lead-free attach material synthesis, 3D integrated thermal packaging, and advanced manufacturing– all focused on designing, manufacturing and qualifying power electronics for reliable use.
F. Patrick McCluskey
Professor, Department of Mechanical Engineering, University of Maryland, College Park, University of Maryland, College Park on January 28, 2022 at 10:15 AM in EB2 1229
Dr. Patrick McCluskey is a Professor of Mechanical Engineering at the University of Maryland, College Park and the Department’s Director of Undergraduate Studies. He has over 25 years of research experience in the areas of thermal management, reliability, and packaging of electronic systems for use in extreme temperature environments and power applications. Dr. McCluskey has co-authored three books, 5 US Patents, and nearly 200 peer-reviewed technical articles with over 3500 citations. He is an associate editor of the IEEE Transactions on Components, Packaging, and Manufacturing Technology, co-chair of the Integrated Power Electronics technical working group of the IEEE Heterogeneous Integration Roadmap, Awards Director and Member of the Board of Governors of the IEEE Electronic Packaging Society, Fellow and Member of the Executive Council of IMAPS, and a member of ASME and AIAA.
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