SRC’s Microelectronics and Advanced Packaging Technologies (MAPT) Roadmap: Driving a New Era of Innovation in Semiconductors and Digital Twins

The semiconductor industry is on the brink of a new era of innovation, propelled by the convergence of Microelectronics and Advanced Packaging Technologies (MAPT). This talk explores how the Semiconductor Research Corporation (SRC) is spearheading this transformation by democratizing and accelerating innovation in research, design, and manufacturing. Central to this initiative is the development of a Digital Twin Platform/Framework (DT backbone) that serves as the foundation for collaborative endeavors. This framework will ensure data and tool accessibility across all members while prioritizing secure management protocols. SRC is fostering an ecosystem where members can engage and exchange ideas, collaborate on project proposals, conduct privately-funded projects, access funding opportunities, and test Digital Twin innovations. An integral aspect of SRC’s MAPT Roadmap is the emphasis on attracting and training a workforce equipped to harness the potential of Digital Twins. By integrating Digital Twin technologies into education and training programs, SRC ensures a pipeline of talent capable of driving innovation forward. Ultimately, SRC’s MAPT roadmap is not only about conceptualization but also about delivery. By seamlessly integrating Digital Twin innovations into the manufacturing value chain, SRC is paving the way for a future where semiconductor advancements are not only envisioned but also realized.

Mr. John Oakley

Science Director, Semiconductor Research Corporation on January 17, 2025 at 10:15 AM in EB2 1231

John Oakley, Science Director at SRC, leads transformative research in Hardware Security, Packaging, AI Hardware, and Supply Chain AI. He fosters collaborations across government, industry, and academia to drive innovation in these critical fields. With over 20 years of experience in mixed-signal design and architecture, he has contributed to major technology firms like Intel, Motorola, Freescale, and Fujitsu, holding 14 patents and developing over 55 integrated devices with significant market impact. His expertise in digital and mixed-signal systems extends to transceivers, modems, and cellular platform control planes, with deep involvement in 3GPP standards, including leadership roles in MIPI RFFE and other working groups. An alumnus of Texas A&M University, he also serves on the Board of the Florida Institute for Cybersecurity Research (FICS), influencing the future of cybersecurity and digital innovation. A sought-after speaker at semiconductor and cybersecurity conferences, John also pursues strategic thinking beyond his profession as a Ruby Life Master in the American Contract Bridge League and an avid strategy and role-playing game enthusiast.

Electrical and Computer Engineering Colloquia

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