Douglas C. Hopkins

Prof. Hopkins' primary research areas are:

* Very high frequency, high density power electronic systems

* Extreme environment electronics, and related solid-state protection

* Organic-based circuits for power and energy systems

* High temperature(>300˚C) metal-matrix composite packaging with integrated ceramics

* True 3D electronic packaging with flexible jet patterning

Prof. Hopkins has over 20 years of experience in electronic energy systems. His early career was at the R&D centers of the General Electric and Carrier Air-Conditioning Companies in advanced power electronics systems for military and commercial applications up to the low MW range.

Prof. Hopkins received his Ph.D. from Virginia Tech where his research focused on zero-current switching converters and cermet packaging. Prior to joining NCSU, he was at the University at Buffalo (SUNY Buffalo) conducting research in high temperature power electronics (>350˚C) and packaging with aluminum-based composites. At NCSU he created the Laboratory for Packaging Research in Electronic Energy Systems (PREES) focusing on high-temperature, high-frequency, 3D packaging using composite materials primarily for wide band gap power semiconductors (e.g. GaN and SiC) .

Prof Hopkins held Visiting Faculty appointments with the Army, NASA, and the Ohio Space Institute. He was co-founder of DensePower, LLC, and conducts expert witness activities through DCHopkins & Associates, LLC. He has published over 100 journal and conference articles, a number recognized with awards. Further information is available from www.DCHopkins.com

Education

1989 - Ph.D. in Electrical Engineering, Virginia Polytechnic Institute and State University (Virgina Tech), Blacksburg, VA

Awards & Honors

Publications

• 6.0kV, 100A, 175kHz super cascode power module for medium voltage, high power applications (2018)
• Design, package, and hardware verification of a high-voltage current switch (2018)
• Performance optimization of A 1.2kV SiC high density half bridge power module in 3D package (2018)
• Flexible epoxy resin substrate based 1.2 kV SiC half bridge module with ultra-low parasitics and high functionality (2017)
• Novel polymer substrate-based 1.2 kV/40 a double-sided intelligent power module (2017)
• Numerical and experimental determination of temperature distribution in 3D stacked power devices (2017)
• Decomposition and electro-physical model creation of the CREE 1200V, 50A 3-Ph SiC module (2016)
• Design methodology for a planarized high power density EV/HEV traction drive using SiC power modules (2016)
• Design, package, and hardware verification of a high voltage current switch (2016)
• Development of an ultra-high density power chip on bus (PCoB) module (2016)