Douglas C. Hopkins

Research Professor

He/Him/His

 919-513-5929
  DCHopkins@ncsu.edu
 Keystone Science Center 23
 Campus Box 7911
  Website
 Curriculum Vitae

Biography

Prof. Hopkins' primary research areas are:

* Very high frequency, high density power electronic systems and packaging

* Extreme environment electronics, and related solid-state protection

* Organic-based circuits for power and energy systems, including high temperature(>300˚C) circuits integrated ceramics and metal matrix composites

Prof. Hopkins is with the Electrical and Computer Engineering at North Carolina State University, Director of the Laboratory for Packaging Research in Electronic Energy Systems (PREES), which is part of the NSF FREEDM Systems Center, and is an affiliate faculty member in the Center for Additive Manufacturing and Logistics CAMAL. He has over 20 years of academic and industrial experience focused on high-frequency, high density power electronics with emphasis on packaging. He received his Ph.D. in Electrical Engineering from Virginia Tech, and spent his early career at the R&D centers of GE and Carrier Air-Conditioning Companies in advanced power electronics systems for military and commercial applications. He has published nearly 200 articles including book chapters, journal and conference papers, a number recognized with awards. He founded and chaired the joint EPS (CPMT)/PELS Technical Committee on Power Electronics Packaging from 1997-2005, and is a present committee member. He is an IMAPS Fellow and member of the IMAPS Executive Council.

Prof Hopkins held Visiting Faculty appointments with the Army, NASA, and the Ohio Space Institute. He was co-founder of DensePower, LLC, and conducts expert witness activities through DCHopkins & Associates, LLC. Further information is available from www.DCHopkins.com

Education

  • Ph.D. 1989
    Electrical Engineering
    Virginia Polytechnic Institute and State University, Blacksburg

Research Focus

  • Power Electronics and Power Systems
  • Electronic Energy Systems Packaging
  • Power Electronics

Expert In

Power Electronics Packaging

Involvement

  • IEEE Power Electronics Society - Technical Committee on Power Components, Integration, and Power ICs (TC2)
    Member
  • IEEE Power Electronics Society - Technical Committee on Emerging Power Electronic Technologies (TC-6)
    Member
  • Int'l Microelectronic Packaging & Assembly Society (IMAPS) - Executive Council
    Director
  • IMAPS Int'l Advanced Power Electronics Packaging Symp (APEPS 2022)
    General Chair
  • IEEE Journal of Emerging and Selected Topics in Power Electronics-JESTPE
    Assoc Editor
  • ASME Journal of Electronics Packaging; IEEE Trans. on: 1. Aerospace and Electronic Systems, 2. Advanced Packaging , 3. Components and Packaging Technologies, 4. Industrial Electronics, 5. Power Electronics.
    Journal Reviewer

Awards & Honors

  • 2021 - Cert. of Appreciation as Founder and General Chair, Int'l Symp on Advanced Power Electronics and Packaging Systems (APEPS)
  • 2016 - Cert. of Appreciation as Founder and General Chair, Int'l Symp on 3D Power Electronics Integration and Manufacturing (3D-PEIM)
  • 2013 - "Outstanding Educator Award" - International Microelectronics and Packaging Society
  • 2007 - Fellow – International Microelectronics and Packaging Society (IMAPS)
  • 2001 - "Outstanding Contribution to Education, Research and Professionalism," IEEE – Region I
  • 1999 - IEEE Third Millennium Medal recipient
  • 1992 - Senior Member – Institute of Electrical and Electronics Engineers (IEEE)

Recent News

New Tech Promises to Boost Electric Vehicle Efficiency, Range

Posted on September 15, 2016 | Filed Under: Faculty and Power and Research

Researchers in NC State’s Department of Electrical and Computer Engineering’s FREEDM Systems Center have developed a new type of inverter device with greater efficiency in a smaller, lighter package – which should improve the fuel-efficienc …

Successful Inaugural 3D-PEIM Symposium

Posted on August 22, 2016 | Filed Under: Events and News

A true success – on June 13-15, 2016, over 80 participants, 11 from outside the US, attended the 1st International Symposium on 3D Power Electronics Integration and Manufacturing (www.3D-PEIM.org) in Raleigh, North Carolina. The symposium o …

 

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