Douglas C. Hopkins
Biography
Prof. Hopkins' primary research areas are:
* Very high frequency, high density power electronic systems
* Extreme environment electronics, and related solid-state protection
* Organic-based circuits for power and energy systems
* High temperature(>300˚C) metal-matrix composite packaging with integrated ceramics
* True 3D electronic packaging with flexible jet patterning
Prof. Hopkins has over 20 years of experience in electronic energy systems. His early career was at the R&D centers of the General Electric and Carrier Air-Conditioning Companies in advanced power electronics systems for military and commercial applications up to the low MW range.
Prof. Hopkins received his Ph.D. from Virginia Tech where his research focused on zero-current switching converters and cermet packaging. Prior to joining NCSU, he was at the University at Buffalo (SUNY Buffalo) conducting research in high temperature power electronics (>350˚C) and packaging with aluminum-based composites. At NCSU he created the Laboratory for Packaging Research in Electronic Energy Systems (PREES) focusing on high-temperature, high-frequency, 3D packaging using composite materials primarily for wide band gap power semiconductors (e.g. GaN and SiC) .
Prof Hopkins held Visiting Faculty appointments with the Army, NASA, and the Ohio Space Institute. He was co-founder of DensePower, LLC, and conducts expert witness activities through DCHopkins & Associates, LLC. He has published over 100 journal and conference articles, a number recognized with awards. Further information is available from www.DCHopkins.com
Education
-
Ph.D.
1989
Electrical Engineering
Virginia Polytechnic Institute and State University, Blacksburg
Research Focus
Funded Research
- FSA — Fabrication of a High Power Capacitor Tester (HPCT) for Advanced Capacitor Testing
- FSA: HENKEL Material Testing Services
- “Demonstration of a Medium Voltage Power Module for High Density Conversion” Task 4.6:Pwr Amer-Hopkins- BP-2
- Highly Robust Integrated Power Electronics Packaging Technology
- PV Inverter Systems Enabled by Monolithically Integrated SiC based Four Quadrant Power Switch (4-QPS)
Awards & Honors
- 2013 - "Outstanding Educator Award" - International Microelectronics and Packaging Society
- 2007 - Fellow – International Microelectronics and Packaging Society (IMAPS)
- 2001 - "Outstanding Contribution to Education, Research and Professionalism," IEEE – Region I
- 1999 - IEEE Third Millennium Medal recipient
- 1992 - Senior Member – Institute of Electrical and Electronics Engineers (IEEE)
Recent News
New Tech Promises to Boost Electric Vehicle Efficiency, Range
Posted on September 15, 2016 | Filed Under: Faculty and Power and Research
Researchers in NC State’s Department of Electrical and Computer Engineering’s FREEDM Systems Center have developed a new type of inverter device with greater efficiency in a smaller, lighter package – which should improve the fuel-efficienc …
Successful Inaugural 3D-PEIM Symposium
Posted on August 22, 2016 | Filed Under: Events and News
A true success – on June 13-15, 2016, over 80 participants, 11 from outside the US, attended the 1st International Symposium on 3D Power Electronics Integration and Manufacturing (www.3D-PEIM.org) in Raleigh, North Carolina. The symposium o …
Recent Publications
- 3-D Prismatic Packaging Methodologies for Wide Band Gap Power Electronics Modules (2021)
- A 40kV/mm Organic Substrate for Low Voltage Power SiP and >10kV Power Modules (2021)
- A New Cascaded SuperCascode High Voltage Power Switch (2021)
- Accessible & Adaptable Approach for Calculating the Thermal Resistance of a Power Package using ParaPower (2021)
- Advanced Dual-Sided Half-bridge Packaging with Epoxy Insulated Metal Substrates (eIMS) (2021)
- Advances in Highly Thermally Conductive Organic Power Packaging (2021)
- Bidirectional Solid-State Circuit Breaker using Super Cascode for MV SST and Energy Storage Systems (2021)
- Design and Characterization of 3.3 kV-15 kV rated DBC Power Modules for Developmental Testing of WBG devices (2021)
- E-Field Reduction Techniques in HV Multi-layered Modules Using New Capacitive Modelling Method (2021)
- Optimized AC/DC Dual Active Bridge Converter using Monolithic SiC Bidirectional FET (BiDFET) for PV Applications (2021)