Tag: 3D-PEIM
Successful Inaugural 3D-PEIM Symposium
August 22, 2016A true success – on June 13-15, 2016, over 80 participants, 11 from outside the US, attended the 1st International Symposium on 3D Power Electronics Integration and Manufacturing (www.3D-PEIM.org) in Raleigh, North Carolina. The symposium offered 39 presentations in 11 sessions, and was led off by three tutorials that focused on “The World of Packaging Technologies and Critical Issues” taught by Professors Douglas Hopkins, Guo-Quan Lu, and Patrick McCluskey.