Requirements for a 3DHI Power Microsystem (3DHIP) and Manufacturing Center
A team with over 100 years of industry and academic experience has co-authored the Integrated Power Electronics (IPE) Chapter 10 of the IEEE Heterogeneous Integration Roadmap (HIR). Their work aims to define an Exemplar 3DHI Power Microsystem (3DHIP) for improved efficiency and power density of integrated voltage regulators and board-mount power supplies in package. This 3DHIP is based on tightly integrated arrays of gallium nitride (GaN) transistors, silicon-on-insulator (SOI) gate drivers, and capacitors. It also requires an open-access 3DHIP Manufacturing Center drawing from industry-leading tool and components suppliers, and facility operators such as Applied Materials, Micross Components, X-Celeprint, NC State Nanofabrication Facility, Hesse Mechatronics US, Tyndall National Institute (Ireland), Power America, NC State Faculty, and more. This work is a part of DARPA's 3DHI goals with a focus on power.
Sponsor
Defense Advanced Research Projects Agency (DARPA)
The grant—running from April 1, 2023 to September 30, 2023—is for a total of $679,526.
Principle Investigators
Douglas C Hopkins
Jong Eun Ryu
More Details
A senior team who co-authored the Integrated Power Electronics (IPE) Chapter 10 of the IEEE Heterogeneous Integration Roadmap (HIR), brings over 100 years of industry and academic experience to:
• Define an Exemplar 3DHI Power Microsystem (3DHIP) which tightly integrates arrays of gallium nitride (GaN) transistors, silicon-on-insulator (SOI) gate drivers and capacitors in a "half-bridge circuit” building block and used with integrated passives (e.g., inductor) technologies. The 3DHIPs significantly improve efficiency and power density of IVRs (Integrated Voltage Regulators) and board-mount PSiPs (power supplies in package) to meet DARPA’s goals in 3DHI with focus on power.
• Define the design, process and equipment requirements for an open-access 3DHIP Manufacturing Center drawing from industry-leading tool and components suppliers, and facility operators such as Applied Materials, Micross Components, X-Celeprint, NCSU-Nanofabrication Facility, Hesse Mechatronics US, Tyndall National Institute (Ireland), selected HIR-IPE team members, Power America, NCSU Faculty, and others to be added during the Phase-0.
